IM has developed three advanced materials platforms for next generation lithography applications. These are:

• Extreme Ultra-Violet (EUV) Photo-Resist materials The IM EUV resist material is a patented new category of small molecule resist, referred to as a Multi-Trigger resist system. For further details please click here
• Spin-on-Carbon (SoC) Hardmask materials: The IM SoC material is a high etch resistance spin on carbon material based on patented fullerene molecules and formulations. For further details please click here
• Electron-Beam (E-Beam) materials: The IM E-Beam material is based on patented fullerene molecules and formulations. For further details please click here

Each of our material platforms consist of patented small molecules, developed to address the specific requirements of each application space.

IM is actively developing relationships with potential strategic partners, licensees, and end-users to advance commercialization of our proprietary materials.